Surface Analysis 2012
This five-day set of short courses on the two major electron spectroscopy techniques, Auger Electron Spectroscopy (AES) and X-ray Photoelectron Spectroscopy (XPS/ESCA) is designed for scientists, engineers, technicians, and students, who would like a detailed understanding of the uses of AES, XPS/ESCA, and Data Processing for surface analysis and depth profiling. The courses can be taken as a 5-day package or individually.
Course Materials
A comprehensive set of notes will be provided for each course participant. You may also order a copy of the 900 page book “Surface Analysis by Auger and X-ray Photoelectron Spectroscopy,” edited by D. Briggs and J.T. Grant, 2003.
Auger Electron Spectroscopy (AES) and Data Processing
Two days: Monday and Tuesday, April 16 and 17, 2012
AES is used to determine the atoms present at a surface, their concentrations, and their lateral and depth distributions. Nano AES involves its application to the analysis of very small regions of a surface, including nano-size particles. Depth profiling of thin films will also be included.
Day 1 Details
Introduction, 0.5 hr.
Terminology
Surfaces
Types of surfaces
The Principles of AES, 2.0 hrs.
Production of Auger electrons
Peak labeling
Ionization cross-sections
Handbooks
Books
Surface sensitivity
Inelastic mean free path and databases
Information depth
Sample handling
Qualitative Analysis, 2.0 hrs.
Direct and derivative spectra
Identification of elements including examples using software
Energy resolution
Peak widths
Chemical effects on kinetic energy and lineshapes
Plasmons
Cross transitions
Ion-excited Auger transitions
Quantitative Analysis, 3.0 hrs.
Auger intensities
Sensitivity factors
Detection limit
Corrections for lineshape changes
Analyzer transmission
Electron multiplier effects
Matrix factors
Average matrix sensitivity factors
Backscattering
Effects of angle of incidence and emission on quantitative analysis
Standard spectra
Diffraction effects
Signal-to-noise
Artifacts, 0.5 hr.
Ionization loss peaks
Electron beam damage
Day 2 Details
Instrumentation, 2.0 hrs.
Field emission electron source
Spatial resolution (beam)
Beam damage
Cylindrical mirror analyzer (CMA)
Hemispherical type analyzer (HSA)
Modes of operations
Electron detection
Pulse counting
Other electron sources
Other types of analyzers
Scattering in analyzers
Vacuum system
Samples
Imaging and Spatial Resolution, 2.0 hrs.
Scanning electron microscopy
Acceptance area of analyzers
Locating regions of interest
Corrections for topography and backscattering
Beam energy
Spatial resolution (analysis)
Comparison of analyzers
Electron energy loss (EELS) imaging
Ratioed scatter diagrams
Line scans
Image registration
Data Acquisition, Processing and Depth Profiling, 2.0 hrs.
Spectrum subtraction
Sputtering
Crater edge profiling
Angle resolved AES
Factor analysis
Linear least squares fitting
Sample rotation
Mechanical methods
Examples of data processing methods to remove peak overlap
Problems
Separating different chemical states
Improving signal-to-noise in sputter depth profiles
Insulating Samples, 1 hr.
Charge control methods
Effects on images and spectra,
Use of low energy ion beam
Applications, 0.8 hr.
Nano analysis of spheres, particles
Via holes, insulators
Sputter depth profiles of nanolayers
Instrument Selection and Summary, 0.2 hr.
Factors to consider
General summary
X-ray Photoelectron Spectroscopy (XPS/ESCA) and Data Processing
Three days: Wednesday through Friday, April 18 through 20, 2012
XPS/ESCA is used to determine the atoms present at a surface, their concentrations, and their lateral and depth distributions. Depth profiling of thin films will also be included.
Day 1 Details
Introduction, 0.5 hr.
Terminology
Surfaces
Types of surfaces
The Principles of XPS, 4 hrs.
Production of photoelectrons
Peak labeling
Electronic configuration of atoms
Binding energies of atoms, molecules and solids
Kinetic energy
Spectra
Auger process
Valence spectra
Handbooks
Books
Surface sensitivity
Inelastic mean free path and databases
Information depth
Sample handling
Spin-orbit splitting
Chemical shift
Curve fitting using software
Plasmons
Multiplet splitting
Shake-up
Data processing to measure intensities of p, d and f doublets
Instrumentation, 4.5 hrs.
Dual anode
Bremsstrahlung
Satellites and their removal using software
Monochromatic source
Electron energy analyzers
Spectrum acquisition
Energy resolution
Scattering in analyzers
Electron detectors
Pulse counting
Position sensitive detectors
Small area analysis
Area location
Imaging XPS
Methods for imaging
Equipment and examples
Day 2 Details
(Instrumentation, con't.)
Software to improve information in images
Energy scale calibration
Vacuum system
Samples
Qualitative Analysis, 4.5 hrs.
Identification of elements including examples using software
Changing x-ray sources
Charging and its effect on qualitative analysis
Interpretation of chemical shift
Making Auger parameter plots online
Factors affecting peak widths
Curve fitting with different lineshapes
Advanced curve fitting using reference spectra
Quantitative Analysis, 4.5 hrs.
Sensitivity factors
Ionization cross section
Asymmetry parameter
Magic angle
Analyzer transmission
Reference spectra
Peak intensities
Background subtraction with examples using software
Day 3 Details
(Quantitative Analysis, con't.)
Measuring peak areas
Using software for quantitative analysis
Detection limits with examples
Artifacts, 1.0 hr.
X-ray damage
Charging and software approaches to improve quantitative analysis of data
Methods for charge control
Ghost peaks
Depth Profiling, 4.8 hrs.
Non-destructive and destructive methods
Angle resolved XPS with examples using software
Diffraction
Elastic scattering
Thickogram
Inelastic loss method with examples using software
Effect of thin overlayers on quantitative analysis
Sputtering
Depth calibration
Examples of data processing methods to
remove peak overlap problems,
separate different chemical states, and
improve signal-to-noise in sputter depth profiles
Instrument Selection and Summary, 0.2 hr.
Factors to consider
General summary
